Ah, sweet irony. Transmeta founder and ex-CEO Dave Ditzel, the guy who meant to tear a really mean piece out of Intel’s haunch only to find his own ass in a sling when Intel kicked back, has turned up at Intel as vice-president of the company’s Digital Enterprise Group (DEG) and chief architect of its hybrid parallel computing architectures.
DEG is where Intel’s got its many-core Larrabee and Terascale chips. Ditzel’s job is to improve the power/performance of Intel’s multi-core efforts, kinda what he was doing at Transmeta with mobile x86 chips before multi-cores became the fashion.
Intel ratcheting up its own low-power efforts coupled with Transmeta’s own screw-ups put the start-up out of the chip business, reduced to hawking its IP.
Ditzel and what’s left of Transmeta parted company a year ago and in October Intel agreed to pay Transmeta $250 million to settle a patent suit in return for a patent license.
Before Transmeta, Ditzel was CTO of Sun Microelectronics and its Sparc chip.